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keywords:("Kraftfahrzeugelektronik")

    Microsystems packaging for automotive applications

    Jung, E. / Wiemer, M. / Grosser, V. et al. | Tema Archive | 2002
    Keywords: Kraftfahrzeugelektronik

    Reliability potential of epoxy based encapsulants for automotive applications

    Braun, T. / Becker, K.F. / Koch, M. et al. | Tema Archive | 2005
    Keywords: Kraftfahrzeugelektronik

    Flip chip technology for multi chip modules

    Jung, E. / Aschenbrenner, R. / Busse, E. et al. | Tema Archive | 1997
    Keywords: Kraftfahrzeugelektronik

    High temperature potential of flip chip assemblies for automotive applications

    Braun, T. / Becker, K.F. / Sommer, J.P. et al. | Tema Archive | 2005
    Keywords: Kraftfahrzeugelektronik

    Lead free alloys for flip chip bumping

    Jung, E. / Aschenbrenner, R. / Kallmayer, C. et al. | Tema Archive | 2001
    Keywords: Kraftfahrzeugelektronik

    Multichip modules for automotive applications

    Simsek, A. / Strohschein, W. / Reichl, H. | Tema Archive | 1999
    Keywords: Kraftfahrzeugelektronik

    The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach

    Jung, E. / Kasulke, P. / Giebler, R. et al. | Tema Archive | 1997
    Keywords: Kraftfahrzeugelektronik

    Alternative solders for flip chip applications in the automotive environment

    Jung, E. / Heinricht, K. / Kloeser, J. et al. | Tema Archive | 1998
    Keywords: Kraftfahrzeugelektronik

    Results of assembly and reliability investigation of an MCM-L for an automotive application: electronic control unit

    Joly, J. / Lambert, D. / Ansorge, F. et al. | Tema Archive | 1998
    Keywords: Kraftfahrzeugelektronik