Finite Element Modeling of Heat Transfer in Chip on Tape Packages
Modeling of Acid Copper Electroplating : A Review
Intelligent Control of an Internal Supply Chain in the Haxd Disk Drive Industry
Integration of Environmental Factors in Pre-Layout Design Optimization for Printed Circuit Boards
A NOVEL CIRCUIT FABRICATION TECHNIQUE USING OFFSET LITHOGRAPHY
Adhesive Flip Chip Bonding on Flexible Substrates
Thermal Model of a Component Package for System Level Applications
The Limits of Automating Electronic Component Rework
On Improving the Performance of Hard Disk Drive Final Assembly via Knowledge Intensive Simulation
Hygrothermal Reliability Evaluation of Plastic IC Packages with Computer-Aided Engineering Tools
Analyzing the Natural Resting Aspects of Plastic Parts in a Vibratory Bowl Feeder
A Study of Solderability and Solder Spreading for SMT Open Joints
Micro- Application of Non-Filled Adhesives for Precision Assembly in Microsystems Manufacturing