41–60 of 179 hits
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    Finite Element Modeling of Heat Transfer in Chip on Tape Packages

    Yang, L. Y. | Online Contents | 1998
    Publisher: World Scientific , Singapore

    Modeling of Acid Copper Electroplating : A Review

    Poon, G. K. K. | Online Contents | 1998
    Publisher: World Scientific , Singapore

    Intelligent Control of an Internal Supply Chain in the Haxd Disk Drive Industry

    Zhao, Z. Y. | Online Contents | 1998
    Publisher: World Scientific , Singapore

    Integration of Environmental Factors in Pre-Layout Design Optimization for Printed Circuit Boards

    Siddhaye, S. | Online Contents | 1998
    Publisher: World Scientific , Singapore

    TECHNOLOGY TRENDS IN ELECTRONICS AND PHOTONICS, THEIR MODELING AND EFFECT ON MANUFACTURING AND ASSEMBLY

    Williams, D. J. | Online Contents | 1997
    Publisher: World Scientific , Singapore

    A NOVEL CIRCUIT FABRICATION TECHNIQUE USING OFFSET LITHOGRAPHY

    Ramsey, B. J. | Online Contents | 1997
    Publisher: World Scientific , Singapore

    Adhesive Flip Chip Bonding on Flexible Substrates

    Aschenbrenner, R. | Online Contents | 1997
    Publisher: World Scientific , Singapore

    Thermal Model of a Component Package for System Level Applications

    Teng, S. | Online Contents | 1997
    Publisher: World Scientific , Singapore

    A DECOMPOSITION METHODOLOGY FOR SCHEDULING SEMICONDUCTOR TEST OPERATIONS FOR NUMBER OF TARDY JOB MEASURES

    Yoo, Wook-Sung | Online Contents | 1997
    Publisher: World Scientific , Singapore

    REWORK OF BGA COMPONENTS

    Chung, C. W. | Online Contents | 1997
    Publisher: World Scientific , Singapore

    The Limits of Automating Electronic Component Rework

    Geren, N. | Online Contents | 1997
    Publisher: World Scientific , Singapore

    On Improving the Performance of Hard Disk Drive Final Assembly via Knowledge Intensive Simulation

    Zhao, Z. Y. | Online Contents | 1997
    Publisher: World Scientific , Singapore

    Hygrothermal Reliability Evaluation of Plastic IC Packages with Computer-Aided Engineering Tools

    Kuo, A.-Y. | Online Contents | 1997
    Publisher: World Scientific , Singapore

    Analyzing the Natural Resting Aspects of Plastic Parts in a Vibratory Bowl Feeder

    Ngoi, B. K. A. | Online Contents | 1997
    Publisher: World Scientific , Singapore

    A Study of Solderability and Solder Spreading for SMT Open Joints

    Teo, K. C. | Online Contents | 1996
    Publisher: World Scientific , Singapore

    Micro- Application of Non-Filled Adhesives for Precision Assembly in Microsystems Manufacturing

    Bauer, A. | Online Contents | 1996
    Publisher: World Scientific , Singapore

    Analysis of Underfill Encapsulation Curing Deformations on Flip Chip on Boaxd (FCOB) Package Reliability

    Pang, J. H. L. | Online Contents | 1998
    Publisher: World Scientific , Singapore