Application of ink screening models to solder paste printing in SMT assembly
Implementation of a decision support system for scheduling semiconductor test operations
Analysis of despatching policies in semiconductor post-test operations
Design and development of a generic PCBA line simulator
Die-bonding of large-area naked chips
Sub-pixel resolution for low-cost SMT component placement inspection systems
Competing in the electronics industry : benchmarking world-class performers
SMT in Singapore: a window into the challenges and practice
Multichip modules (MCMs) : a review of the status quo