Neue Klimaautomatik im Fahrzeugsitz erhöht den Komfort
In-depth characterization of die attach adhesive for low-k automotive device application
Micro-rotation angle sensor with integrated hall IC
Scaling of temperature sensors for smart power MOSFETs
Dispersion and the worst case of thermal fatigue life of solder joints in vehicle electronic devices
Effect of post-mold curing of epoxy molding compound on wirebond reliability in a MOSFET
Hall effect based transmission speed sensor IC with direction detection and vibration suppression
Stainless steel bipolar plates for direct methanol fuel cells (DMFC)
Highly integrated tire pressure monitoring solutions
Drucksensorsignale im Fahrzeug einfacher und präziser aufbereitet
Accelerometer design for vehicle control safety system
A single-chip smart pressure sensor family with 2 dimensional calibration
Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits
A new Ag/Pd conductor for automotive applications
3-layered 3D flex based MCM: electrical characterization and reliability issues