The Limits of Automating Electronic Component Rework
On Improving the Performance of Hard Disk Drive Final Assembly via Knowledge Intensive Simulation
Analysis of Design Efficiency for the Disassembly of Modular Electronic Products
Solder Paste Deposition Through High Speed Stencil Printing for a Contract Assembly Environment
An Integrated Methodology for Surface Mount PCB Configuration
Failure Mechanisms in Semiconductor Devices : E. Ajith Amerasekera and Farid N. Najm (Book review)
Micro-Jet Printing of Polymers and Solder for Electronics Manufacturing
A Practical Algorithm for Cyclic Hoist Scheduling in a PCB Manufacturing Facility
An Experimental Study of the Self Centering of BGA Packages