11–20 of 55 hits
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    Assembly issues in replacing a high cost hermetically sealed hybrid with a low cost non-hermetic assembly for prolonged use at 180 degrees C

    Whitehurst, J. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Assembly reliability of Ball Grid Array and chip scale packages for high reliability applications

    Ghaffarian, R. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    A status of the United States Air Force's More Electric Aircraft initiative

    Cloyd, J.S. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    ATS in the Air Force: the legacy and its challenges

    Holm, D. / Haffarnan, J. / Dean, J. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Blending borescope inspection (BBI) maintenance service equates to cost savings

    Adair, T.L. / Owens, J.L. / Grady, G. et al. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    COTS fiber optic interconnect solutions for mobile platforms

    Horwitz, D. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Designing for determinism: lessons learned from modern real-time avionics applications

    Preston, J.D. / Kegley, R.B. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Development of a prognostics and health management capability for the Joint Strike Fighter

    Smith, G. / Schroeder, J.B. / Navarro, S. et al. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Driver state prediction from vehicle signals: An evaluation of segmentation approaches

    Free access
    Maritsch, Martin / Koch, Kevin / Thomsen, Hauke et al. | BASE | 2022
    Publisher: Institute of Electrical and Electronics Engineers , KITopen (Karlsruhe Institute of Technologie)

    Economics of diagnosis

    Ambler, A.P. / Bassat, M.B. / Ungar, L.Y. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York