The effects of cyclic thermal loading on n-type 4H-SiC device components for EM-gun pulsers
The four steps to achieve a reliable design
The International Space University: its missions and programs
The new vision for modeling and simulation in the DoD acquisition process
The past, present and future of EEE components for space application; COTS-the next generation
Thermal characterisation and heat transfer analysis of a wire bond chip-on-board package