61–70 of 70 hits
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    The effects of cyclic thermal loading on n-type 4H-SiC device components for EM-gun pulsers

    Cole, M.W. / Hubbard, C. / Demaree, D. et al. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    The four steps to achieve a reliable design

    Oliveto, F.E. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    The International Space University: its missions and programs

    Bali, S. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    The new vision for modeling and simulation in the DoD acquisition process

    McQuay, W.K. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    The past, present and future of EEE components for space application; COTS-the next generation

    Wall, J. / Sinnadurai, N. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    The potential for energy-efficient technologies to reduce carbon emissions in the United States: transport sector

    Greene, D.L. / Plotkin, S. / Duleep, K.G. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Thermal characterisation and heat transfer analysis of a wire bond chip-on-board package

    Pang, H.L.J. / Toh, K.C. / Tan, C.K. et al. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Thermal deformation and strength of heat-protective coatings under operating conditions simulating the real ones

    Gracheva, L.I. / Borisenko, V.A. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Thermal performance of plastic-encapsulated and hermetically sealed components for automotive applications

    Musiejovsky, L. / Nicolics, J. / Hauser, H. et al. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    VTest system overview

    Dearborn, W.R. / Perkins, E.G. / Wong, J.J. et al. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York