Plastic-molded package of AlGaInP laser apparatus [2683-07]
Fluxless Sn-Ag solder ball formation for flip-chip application [2691-08]
Optically controlled ultrawideband transceiver [2844-31]
Thermal shift in the exciton absorption maxima as a function of the chip package design [2691-20]
Analog and Digital Meter Recognition Using Computer Vision
The Unsteady Pressure Field on a Wing with Large Regions of Separated Flow
Tunable long-wavelength interdiffused quantum well photodector [2897-505]
Quality of optical thin films: integrated optics versus optical coating [2891-509]
The Combustion Characteristics of Hydrogen Fueled Single Cylinder Engine
Flexure Bearing Analysis Procedures and Design Charts
A Trajectory Optimization Model to Support Aviation Systems Analysis
Error prediction of the Gaussian ML classifier in remotely sensed data [3159-17]