Analysis of despatching policies in semiconductor post-test operations
Design and development of a generic PCBA line simulator
SMT in Singapore: a window into the challenges and practice
Multichip modules (MCMs) : a review of the status quo
Joining of displays using thermosetting anisotropically conductive adhesives
Development goals and present status of 3M's adhesive interconnection technology
Properties of anisotropic conductive adhesive pastes for fine-pitch surface mount technology
Debonding of adhesively joined electronic circuits for recycling
Die-bonding of large-area naked chips
Sub-pixel resolution for low-cost SMT component placement inspection systems
Competing in the electronics industry : benchmarking world-class performers
Performance evaluation of dispatching rules for semiconductor testing operations
Alternative substrates for power electronic circuits : an experimental evaluation
Visual servoing : real-time control of robot manipulators based on visual sensory feedback
Quantitative Performance Evaluation of Thining Algorithms in the Presence of Noise