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In-depth characterization of die attach adhesive for low-k automotive device application
Micro-rotation angle sensor with integrated hall IC
Scaling of temperature sensors for smart power MOSFETs
Dispersion and the worst case of thermal fatigue life of solder joints in vehicle electronic devices
Effect of post-mold curing of epoxy molding compound on wirebond reliability in a MOSFET
Hall effect based transmission speed sensor IC with direction detection and vibration suppression
Stainless steel bipolar plates for direct methanol fuel cells (DMFC)
Highly integrated tire pressure monitoring solutions
Accelerometer design for vehicle control safety system
A single-chip smart pressure sensor family with 2 dimensional calibration
A new Ag/Pd conductor for automotive applications
3-layered 3D flex based MCM: electrical characterization and reliability issues
Alternative solders for flip chip applications in the automotive environment
Accelerometers for automotive applications
Innovations in acceleration sensing using surface micro-machining