3D integration of image sensor SiP using TSV silicon interposer
Alternative solders for flip chip applications in the automotive environment
High temperature potential of flip chip assemblies for automotive applications
Integration of micro-mechatronics in automotive applications
Micro-mechatronics in automotive applications
Micro-opto-electro-mechanical-systems (MOEMS) in automotive applications
Modellierung und Anwendung von Silizium-Mikrofonsystemen
Multichip modules for automotive applications
New principle for front light systems in automotive applications
Reliability potential of epoxy based encapsulants for automotive applications