1–10 of 103 hits
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    Driver state prediction from vehicle signals: An evaluation of segmentation approaches

    Free access
    Maritsch, Martin / Koch, Kevin / Thomsen, Hauke et al. | BASE | 2022
    Publisher: Institute of Electrical and Electronics Engineers , KITopen (Karlsruhe Institute of Technologie)

    Evaluation of advanced automotive electrical system architectures using MAESTrO

    Afridi, K.K. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Implementation of adaptive processing in integrated active-passive sonars with multi-dimensional arrays

    Stergiopoulos, S. / Dhanantwari, A.C. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Blending borescope inspection (BBI) maintenance service equates to cost savings

    Adair, T.L. / Owens, J.L. / Grady, G. et al. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Microtechnology for space systems

    Janson, S. / Helvajian, H. / Amimoto, S. et al. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Results of assembly and reliability investigation of an MCM-L for an automotive application: electronic control unit

    Joly, J. / Lambert, D. / Ansorge, F. et al. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    The effects of cyclic thermal loading on n-type 4H-SiC device components for EM-gun pulsers

    Cole, M.W. / Hubbard, C. / Demaree, D. et al. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Experimental application of digital PD measurements to the diagnostics of railway system drives insulating systems

    Centurioni, L. / Coletti, G. / Guastavino, F. et al. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Silicon carbide on silicon-an ideal material combination for harsh environment sensor applications

    Kroetz, G. / Wondrak, W. / Obermeier, E. et al. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Assembly issues in replacing a high cost hermetically sealed hybrid with a low cost non-hermetic assembly for prolonged use at 180 degrees C

    Whitehurst, J. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York