3-layered 3D flex based MCM: electrical characterization and reliability issues
A case study of IC storage failures in Taipei trains
Alternative solders for flip chip applications in the automotive environment
A monolithic speed-control micro-system for automatotive applications
A new Ag/Pd conductor for automotive applications
An experimental thermal characterization of a 272 PBGA within an automotive engine controller module
An improved automatic system for control of routine gearbox and clutch operations in vehicles
An integrated circuit modular library for angle-based engine control
A powertrain control SOI BiCMOS LSI for an automotive application
Ball grid array reliability assessment for aerospace applications
Board-level characterization of 1.0 and 1.27 mm pitch PBGA for automotive under-hood applications
Die Steuerung eines vollvariablen elektromechanischen Ventilbetriebs
Feasibility of a cryogenic multiplexer for spaceborne applications