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encapsulation
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Research project for reducing the noise of truck Diesel engines
Some aspects concerning noise reduction on diesel passenger cars
Submarine telecommunications systems, int. Conf.; Febr. 26-29, 1980, London, GB (Part.3)
Application research on a grinding robot system - grinding of rolling stock parts
Multilayer alumina substrates for ECU (automotive electronics)
Microwave multichip modules using low cost microwave chip on flex packaging technology
3-layered 3D flex based MCM: electrical characterization and reliability issues
Variable emissivity through MEMS technology
Acceleration threshold switches from an additive electroplating MEMS process
Accelerated testing of flip chip packages under dynamic load
TPE-Glasumspritzung von Fahrzeugen, TPE-glass encapsulation
Model for BGA and CSP reliability in automotive underhood applications
A study of chip top delamination in plastic encapsulated packages under temperature loading
A Novel Technology for Thermal Control for ISP module for Space Applications
Jet Blast Resistance Experiment of Engineered Material Arresting System