A "Closed Loop'' System for the Realtime Control of Solder Paste Stencil Printing
A Computational Model for Forced Convection Cooling in Electronic Components
A Decision-Support Tool for Printed Circuit Board Assembly
Adhesive Flip Chip Bonding in a Miniaturized Spectrometer
Adhesive Flip Chip Bonding on Flexible Substrates
Advanced superfine-pitch technology
A Framework for the Flexible Grouping of Products for Disassembly