Synonyms were used for: encapsulation
Search without synonyms: keywords:(encapsulation)

1–50 of 142 hits
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    Engine encapsulation for increased fuel efficiency of road vehicles

    Minovski, Blago / Chalmers tekniska högskola | TIBKAT | 2017
    Keywords: Verkapseln

    Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests

    Corazza, Michael / Krebs, Frederik C. / Gevorgyan, Suren A. | Tema Archive | 2014
    Keywords: Verkapseln

    Reduktion der Kältemittelfüllmenge im Pkw durch den Einsatz von kompakten Kältemittelkreisläufen

    Menken, Jan Christoph / Weustenfeld, Thomas A. / Köhler, Jürgen | Tema Archive | 2014
    Keywords: Kapselung

    Innovative vibro-acoustic metamaterials to provide lightweight NVH solutions

    Claeys, Claus / Pluymers, Bert / Desmet, Wim | Tema Archive | 2014
    Keywords: Einkapselung

    Thesound reduction index applied to automotive problems

    Duvigneau, Fabian / Gabbert, Ulrich | Tema Archive | 2014
    Keywords: Einkapselung

    Jet Blast Resistance Experiment of Engineered Material Arresting System

    Xiao, Xian-Bo / Kong, Xiang-Jun / Shi, Ya-Jie et al. | Tema Archive | 2013
    Keywords: Einkapselung

    Comparison and Application of High Prestress and Intensive Support System in Close, Soft and Cracked Roadway Support

    Hu, Bin / Kang, Hong-Pu / Lin, Jian | Tema Archive | 2012
    Keywords: Einkapselung

    Heat transfer and thermal management of electric vehicle batteries with phase change materials

    Ramandi, M.Y. / Dincer, I. / Naterer, G.F. | Tema Archive | 2011
    Keywords: Kapselung

    High density packaging for automotive applications

    Sommer, J.P. / Michel, B. / Hofmann, Th et al. | Tema Archive | 2011
    Keywords: Chip-Größen-Kapselung

    Stability of spore-based biosensing systems under extreme conditions

    Sangal, Abhishek / Pasini, Patrizia / Daunert, Sylvia | Tema Archive | 2011
    Keywords: Kapselung

    A Novel Technology for Thermal Control for ISP module for Space Applications

    Monti, Riccardo / Barboni, Renato / Gasbarri, Paolo et al. | Tema Archive | 2010
    Keywords: Wärmehaushalt (Kapselung)

    Capping technologies for MEMS

    Hausnear, R. / Stahl, H. | Tema Archive | 2010
    Keywords: Einkapselung

    New method to determine the range of DVB-H networks and the influence of MPE-FEC rate and modulation scheme

    Plets, David / Joseph, Wout / Verloock, Leen et al. | Tema Archive | 2009
    Keywords: MPE (multiprotocol encapsulation)

    Innovatives Wärmemanagement - ein Schlüssel zur Reduzierung der CO2- Emissionen im Fahrzeug

    Eder, A. / Kurz, G. / Liebl, J. | Tema Archive | 2008
    Keywords: Kapselung

    MEMS package in a harsh environment for aeronautic applications

    Friedberger, Alois / Gradolph, Christian / Klettner, Florian et al. | Tema Archive | 2008
    Keywords: Verkapseln

    Akustisch optimierte Zusatzmaßnahmen auf einer blasgeformten Motorkapsel

    Völker, Christine / Filz, Martin / Hansen, Michael | Tema Archive | 2007
    Keywords: Kapselung

    Technologien zur funktionellen Integration von Akustik, Aerodynamik und Wärmemanagement

    Patsouras, Dimitrios | Tema Archive | 2007
    Keywords: Kapselung

    Hydrogen for a global application to road transport

    Rinaldi, P. / Veca, G.M. | Tema Archive | 2007
    Keywords: Einkapselung

    Test method for availability of holes in height - temperature barrier on cementation process

    Valentin Tcenev, I. / Fillipov, F. | Tema Archive | 2007
    Keywords: Wärmehaushalt (Kapselung)

    High efficiency, high reliability 2 kW inverter for aeronautical application

    Vieillard, S. / Meuret, R. | Tema Archive | 2007
    Keywords: Wärmehaushalt (Kapselung)

    A study of chip top delamination in plastic encapsulated packages under temperature loading

    Kravchenko, G. / Bohm, C. | Tema Archive | 2007
    Keywords: Verkapseln

    Metal-enclosed, air-insulated traction switchgear - developments and applications

    Lönard, Detlef / Northe, Jens | Tema Archive | 2006
    Keywords: Kapselung

    Ein neuer Außengeräuschprüfstand im Entwicklungsprozess bei BMW

    Finsterhoelzl, Herbert | Tema Archive | 2006
    Keywords: Verkapseln

    Reliability potential of epoxy based encapsulants for automotive applications

    Braun, T. / Becker, K.F. / Koch, M. et al. | Tema Archive | 2005
    Keywords: Verkapseln

    Optimierung eines Fahrzeugkühlsystems für instationären Betrieb

    Genger, Michael / Widdecke, Nils / Wiedemann, Jochen | Tema Archive | 2005
    Keywords: Verkapseln

    Möglichkeiten zur Schallreduzierung bei Deckeln und Hauben

    Hacker, Günther | Tema Archive | 2005
    Keywords: Verkapseln

    Thermal characterization of a mercury arc lamp for a projection display system

    Bush, B. / Li, Shu / Kelley, D. | Tema Archive | 2004
    Keywords: Wärmehaushalt (Kapselung)

    Maximizing lumen output of LEDs for automotive exterior signal lighting applications

    Conn, L.G. | Tema Archive | 2003
    Keywords: Wärmehaushalt (Kapselung)

    Kapselung des Kraftaggregates der Automobile des Automobilwerkes Minsk

    Gauchstejn, I.S. / Korsakov, V.V. / Kunovskij, E.B. et al. | Tema Archive | 2003
    Keywords: Kapselung

    TPE-Glasumspritzung von Fahrzeugen, TPE-glass encapsulation

    Creusen, M. | Tema Archive | 2003
    Keywords: Einkapselung

    New development of a wet brake system

    Nowak, S. | Tema Archive | 2002
    Keywords: Verkapseln

    Enabling technologies for integrated system-on-a-package for the next generation aerospace applications

    Young, J.J. / Malshe, A.P. / Brown, W.D. et al. | Tema Archive | 2002
    Keywords: Wärmehaushalt (Kapselung)

    Neue Werkstoffe und Entwicklungs-Tools für den Hitzeschutz

    Cierocki, K. / Bridge, D. | Tema Archive | 2001
    Keywords: Kapselung

    Titanium armor applications in combat vehicles

    Montgomery, J.S. / Wells, M.G.H. | Tema Archive | 2001
    Keywords: Verkapseln

    Optimized cooling systems for high-power semiconductor devices

    Baumann, H. / Heinemeyer, P. / Staiger, W. et al. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Novel composites for space microelectronics and optics

    Kowbel, W. / Champion, W. / Oliver, P. et al. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Lead free alloys for flip chip bumping

    Jung, E. / Aschenbrenner, R. / Kallmayer, C. et al. | Tema Archive | 2001
    Keywords: Chip-Größen-Kapselung

    Accelerated testing of flip chip packages under dynamic load

    Rau, I. / Miessner, R. / Liebing, G. et al. | Tema Archive | 2001
    Keywords: Flip-Chip-Verkapselung

    Submarine Horizontal Launch TACTOM Capsule

    J. C. Callahan | NTIS | 2001
    Keywords: Encapsulation

    Variable emissivity through MEMS technology

    Garrison Darrin, A. / Osiander, R. / Champion, J. et al. | Tema Archive | 2000
    Keywords: Wärmehaushalt (Kapselung)

    Acceleration threshold switches from an additive electroplating MEMS process

    Michaelis, S. / Timme, H.J. / Wycisk, M. et al. | Tema Archive | 2000
    Keywords: Chip-Größen-Kapselung