1–10 of 54 hits
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    Assembly issues in replacing a high cost hermetically sealed hybrid with a low cost non-hermetic assembly for prolonged use at 180 degrees C

    Whitehurst, J. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Incremental avionics upgrades for legacy aircraft

    Nelson, J. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    An overview of the VITAL program

    Hodges, W.D. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Thermal characterisation and heat transfer analysis of a wire bond chip-on-board package

    Pang, H.L.J. / Toh, K.C. / Tan, C.K. et al. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Economics of diagnosis

    Ambler, A.P. / Bassat, M.B. / Ungar, L.Y. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Enhanced fault management for future IMA systems

    Wilcock, G.W. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Multilevel simulation of force XXI fire support operations

    Hamilton, J.A. / Sobiesk, E.J. / Deal, J.C. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    The four steps to achieve a reliable design

    Oliveto, F.E. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    ATS in the Air Force: the legacy and its challenges

    Holm, D. / Haffarnan, J. / Dean, J. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    SEI level 3 compliance in the TPS industry

    Pressler, D.R. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York