A "Closed Loop'' System for the Realtime Control of Solder Paste Stencil Printing
A Computational Model for Forced Convection Cooling in Electronic Components
A continuously variable ER damper with energy generation
A Decision-Support Tool for Printed Circuit Board Assembly
Adhesive Flip Chip Bonding in a Miniaturized Spectrometer
Adhesive Flip Chip Bonding on Flexible Substrates