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encapsulation
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Variable emissivity through MEMS technology
UV‐induced degradation of PERC solar modules with UV‐transparent encapsulation materials
TPE-Glasumspritzung von Fahrzeugen, TPE-glass encapsulation
Totally enclosed heat pipe cooled induction motor (theoretical and experimental results)
Thermal management of military fighter aircraft electro-optics pod: an invited paper
Thermal management for high performance computing in spaceborne applications
Thermal characterization of a mercury arc lamp for a projection display system
The changing automotive environment: high-temperature electronics
Test method for availability of holes in height - temperature barrier on cementation process
Submarine telecommunications systems, int. Conf.; Febr. 26-29, 1980, London, GB (Part.3)
Stackable In-Line Underwater Missile Launch System for a Modular Payload Bay
Stability of spore-based biosensing systems under extreme conditions
Specification of EX'e' enclosures for electrical equipment for use in hazardous atmosphaeres
Source characterization of the lower front-end of a diesel engine
Some aspects concerning noise reduction on diesel passenger cars
Some aspects concerning noise reduction of passenger cars with diesel and gasoline engines
Satellite X4: The 100-element self-scanned photodiode array experiment
Research project for reducing the noise of truck Diesel engines
Reliability potential of epoxy based encapsulants for automotive applications
Reliability considerations for switched mode power supplies for use in railway applications
Reduction in size and weight of electronic modules through the evolution of packaging design
Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits
PV degradation curves: non‐linearities and failure modes
Purchase Description Transformer and Inductors for Use in Air Launched Guided Missiles
Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests