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Kälteleistung
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3-layered 3D flex based MCM: electrical characterization and reliability issues
2009 Journal of Thyermophysics and Heat Transfer Subject Index
Aerodynamic Analysis of Total Temperature Probe Thermal Performance Using Conjugate Heat Transfer
Analysis of Enhanced Heat Transfer Performance Through Duct with Constant Wall Temperature
Analytical Model for Characterization of Loop Heat Pipes
Analyzing Thermal Module Developments and Trends in High-Power LED
A new base plate concept on the basis of aluminium-copper clad materials
Boiling at Subatmospheric Pressures with Enhanced Structures
Carbon Nanotube Arrays for Enhanced Thermal Interfaces to Thermoelectric Modules
Comparative Study of the Thermal Performance of Corrugated Channels Using ZnO–Water Nanofluid
Comparing substrate solutions for automotive power electronics applications
Computational Design of Microvascular Radiative Cooling Panels for Nanosatellites
Conjugate Heat Transfer in a Thin Microchannel Filled with a Porous Medium
Design and development of a shape memory alloy activated heat pipe-based thermal switch
Design of a Dual Latent Heat Sink for Pulsed Electronic Systems