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Kraftfahrzeugelektronik
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3D integration of image sensor SiP using TSV silicon interposer
Alternative solders for flip chip applications in the automotive environment
High temperature potential of flip chip assemblies for automotive applications
Micro-mechatronics in automotive applications
Micro-opto-electro-mechanical-systems (MOEMS) in automotive applications
Modellierung und Anwendung von Silizium-Mikrofonsystemen
Multichip modules for automotive applications
New principle for front light systems in automotive applications