Robust Optimization of a Lead‐Free Reflow Soldering Process
Robust Optimization of a Lead‐Free Reflow Soldering Process
- New search for: Chowdhury, Subir
- New search for: Taguchi, Shin
Traditional optimization approaches focus on maximizing the response variable while the robust approach focuses on consistent results regardless of variation in noise factors. Taguchi's robust engineering methodology was utilized in the development of a lead‐free process for manufacturing an automotive surface mount (SMT) product. SMT was chosen due to the drop‐in replacement potential for this soldering technique, as opposed to wave soldering or selective soldering, which are much more immature fields in terms of lead‐free development. The first step in robust engineering approach was to determine what response to measure. The second step was to identify the key process factors that effect wetting results. This was done by developing a process map for the SMT process (PMAP) and a failure mode and effects analysis table (FMEA). The final step is confirmation of the signal to noise for the baseline, optimum and gain.
Document information
Robust Optimization of a Lead‐Free Reflow Soldering Process
2016-02-10
16 pages
Article/Chapter (Book)
Electronic Resource
English
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