The paper discusses some approaches to optimal thermal and hydraulic design of compact plate-and-fin heat exchangers, cold plate for cooling of electronic components and environmental control systems (ECS) for aircraft and ground vehicles. The compact heat exchangers and cold plates are manufactured using the advanced brazing technology (including the vacuum brazing process) which allows to fabricate the intricated finned passages for flowing fluids while satisfying the requirements of high quality, high structural strength and low weight. Different aspects of the computer-aided thermal and hydraulic design of compact plate-and-fin heat exchangers and cold plates for cooling of electronic equipment are analyzed. The approximate Omega method of heat exchanger optimization is compared with more general approach involving the random optimum search algorithm. The paper presents the mathematical model for the analysis of thermal performance of convectively cooled cold plates with finned passages. A methodology for the whole cooling or environmental control systems design and optimization is proposed.


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    Title :

    Optimal thermal and hydraulic design of compact heat exchangers and cold plates for cooling of electronic components


    Additional title:

    Die optimale thermische und hydraulische Auslegung von kompakten Wärmetauschern und Kühlplatten für die Kühlung von elektronischen Bauteilen


    Contributors:


    Publication date :

    1993


    Size :

    20 Seiten, 11 Bilder, 1 Tabelle, 11 Quellen



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    Optimal Thermal and Hydraulic Design of Compact Heat Exchangers and Cold Plates for Cooling of Electronic Components

    Abramzon, B. / Ostersetzer, S. / Assembly of World Conferences on Experimental Heat Transfer, Fluid Mechanics and Thermodynamics et al. | British Library Conference Proceedings | 1993


    Optimal Thermal and Hydraulic Design of Compact Heat Exchangers and Cold Plates for Cooling of Electronic Components

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