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    Lead-free solder development for automotive electronics packaging applications

    Lead-free solder development for automotive electronics packaging applications


    This paper is an overview of environmetal issues involved in the manufacturing of electronic packages for automotive applications, including the development of lead-free solders for no-clean thick film and printed wiring board (PWB) modules. This paper discusses issues that need to be addressed in the development of lead-free solders for automotive electronics packaging applications. These issues include: solder alloy development and selection; flux compatibility for no-clean application; lead-free component terminations and substrate coatings, thermal impact on temperature sensitive components; metallurgical interactions; electromigration and dendritic growth; durability testing; etc.

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    Title :

    Lead-free solder development for automotive electronics packaging applications

    Additional title:

    Entwicklung bleifreier Lote für Kraftfahrzeugelektronik-Bauelemente

    Contributors:
    Shangguan, Dongkai (author) / Achari, A. (author)
    Published in:

    SMI, Surface Mount International, Advanced Electronics Manufacturing Technology, Annual Conference, 5 ; 423-428

    Publication date :

    1995

    Size :

    6 Seiten, 2 Bilder, 1 Tabelle, 8 Quellen

    Type of media :

    Conference paper

    Type of material :

    Print

    Language :

    English

    Keywords :

    Kraftfahrzeugelektrik , Lötverbindung , Blei , Bestücken von Leiterplatten , Dickschichttechnik , gedruckte Schaltung , Temperaturwechselbeständigkeit , Flussmittel , Elektromigration , Langzeitverhalten , Zuverlässigkeit , Wärmeleitfähigkeit , Silberlegierung , Zinnlegierung , Eutektikum

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