Polysilicon packaging and a new anchoring technology for thick SOI mems - Dynamic response model and application to over-damped inertial sensors

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Polysilicon packaging and a new anchoring technology for thick SOI mems - Dynamic response model and application to over-damped inertial sensors

Diem, B. / Barbe, J.C. / De Crecy, F. / Giroud, S. / Renaud, D. / Grange, H. / Hammond, J. / Vandemeer, J. / Roop, R. / Gogoi, B.

Abstract

A new technology has been developed that combines high aspect ratio SOI surface micromachining with polysilicon packaging and a new nitride anchor process with robust release etch manufacturing margin. Based on an accurate damping model, the thickness of the SOI layer was defined to achieve an overdamped mechanical response and high performance on a low g accelerometer. Over-damping is required to filter the noise from parasitic vibration in automotive applications. This technology was designed for low cost and high performance inertial sensors

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Document information

Title :

Polysilicon packaging and a new anchoring technology for thick SOI mems - Dynamic response model and application to over-damped inertial sensors

Contributors:

Diem, B. (author) / Barbe, J.C. (author) / De Crecy, F. (author) / Giroud, S. (author) / Renaud, D. (author) / Grange, H. (author) / Hammond, J. (author) / Vandemeer, J. (author) / Roop, R. (author) / Gogoi, B. (author)

Published in:

Transducers, International Conference on Solid-State Sensors, Actuators and Microsystems, 13 ; 527-530

Publication date :

2005

Size :

4 Seiten, 8 Quellen

ISBN :

0-7803-8994-8

DOI :

https://doi.org/10.1109/SENSOR.2005.1496470

Type of media :

Conference paper