Reliability of Au/Al bonding in plastic packages for high temperature (200 degrees C) and high current applications
Reliability of Au/Al bonding in plastic packages for high temperature (200 degrees C) and high current applications
- New search for: Passagrilli, C.
- New search for: Gobbato, L.
- New search for: Tiziani, R.
- New search for: Passagrilli, C.
- New search for: Gobbato, L.
- New search for: Tiziani, R.
In the automotive field the need exists to increase the maximum operating temperature of plastic packages from 150 degrees C to 180 degrees C and 200 degrees C. One major concern is the lifetime of Au/Al bond under the combined effect of high temperature and high current. In this study the failure mechanisms have been investigated using different molding compounds and different finishing of bonding pads. For selected combinations of materials the lifetime increases up to 50 times compared to the current technology.
Document information
Reliability of Au/Al bonding in plastic packages for high temperature (200 degrees C) and high current applications
ESREF, European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, 13 ; 1523-1528
Microelectronics Reliability ; 42 , 9-11
2002
6 Seiten, 6 Quellen
Conference paper
English
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