MIL-A-87172: A new MIL spec for microelectronic adhesives
MIL-A-87172: A new MIL spec for microelectronic adhesives
- New search for: Stewart, W.C.
- New search for: Ebel, G.H.
- New search for: Stewart, W.C.
- New search for: Ebel, G.H.
Since the introduction of adhesive into microcircuits in the late 1960's, adhesives have found widespread application for component attach in both hermetic and non-hermetic microelectronic packages. This article addresses the use of such adhesively only in hermetic packages. It does not deal with the additional reliability problems encountered when adhesives are used in plastic or other non-hermetic packages. Field history of microelectronic devices utilizing polymeric adhesives for component attach has revealed many subtle testing and long-term reliability problems associated with these materials. As a result, a new military specification for microelectronic adhesives has been released. This paper will present the data that shows the need to control the manufacture, use, and testing of such adhesives, and the requirements that have been developed to accomplish this end.
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MIL-A-87172: A new MIL spec for microelectronic adhesives
MIL-A-87172 - neue militaerische Anforderungen an Klebstoffe fuer die Mikroelektronik
36th Electronic Components Conf. ; 296-301
1986
6 Seiten, 2 Bilder, 3 Tabellen, 20 Quellen
Conference paper
English
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