Various types of solder and application techniques have been evaluated in order to improve the survivability of solar array interconnections during thermal cycling. The performance of each method has been compared by visual examination of the bonded joints, pull tests and resistance measurements before and after thermal cycling. The samples have been cycled up to 20.000 times from -75 Cel to +65 Cel to simulate the temperature environment typically encountered by solar arrays in low earth orbit. The results of these tests show that tin-silver solder will withstand thermal cycling with minimal degradation, when compared to the frequently used tin-lead-silver type.
Alternative methods for bonding solar array interconnects
Alternative Methoden fuer das Bonden der Verbindungen von Sonnenbatterien
1984
6 Seiten, 7 Bilder, 2 Tabellen, 10 Quellen
Conference paper
English
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