Various types of solder and application techniques have been evaluated in order to improve the survivability of solar array interconnections during thermal cycling. The performance of each method has been compared by visual examination of the bonded joints, pull tests and resistance measurements before and after thermal cycling. The samples have been cycled up to 20.000 times from -75 Cel to +65 Cel to simulate the temperature environment typically encountered by solar arrays in low earth orbit. The results of these tests show that tin-silver solder will withstand thermal cycling with minimal degradation, when compared to the frequently used tin-lead-silver type.


    Access

    Access via TIB

    Check availability in my library


    Export, share and cite



    Title :

    Alternative methods for bonding solar array interconnects


    Additional title:

    Alternative Methoden fuer das Bonden der Verbindungen von Sonnenbatterien


    Contributors:
    Kelly, G.J. (author)


    Publication date :

    1984


    Size :

    6 Seiten, 7 Bilder, 2 Tabellen, 10 Quellen


    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    VCSEL Array Technology for Optical Interconnects

    IEEE | British Library Conference Proceedings | 1999


    Prisms march in array for optical interconnects

    British Library Online Contents | 1999


    Laser Array Concepts for Parallel Optical Interconnects

    IEEE / Lasers and Electro-Optics Society | British Library Conference Proceedings | 1995



    High Capacity Optical Interconnects for Phased Array Beamformers

    Alameh, K. E. / Minasian, R. A. / Fourikis, N. | British Library Online Contents | 1995