Investigation of Temperature Generalization for PCM-Based Cooling Plate Used for Remotely Located Electronics

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Investigation of Temperature Generalization for PCM-Based Cooling Plate Used for Remotely Located Electronics

Wu, Bo / Wang, Bin / Zhao, Liang / Han, Junjie

In the present study, investigation of temperature generalization is performed to characterize the complex heat transfer process within a PCM -based cooling plate used for electronics remotely located in aircraft. Firstly, a simplified physical model is abstracted from the PCM-based cooling plate serving in actual applications where the cooling plate undergoes a complex heat transfer process with thermal conduction, thermal storage, thermal convection, and thermal radiation coupling with each other. Dimensionless numbers are defined to generalize the physical quantities associated with transient heat transfer with phase change. The comprehensive heat transfer process is then numerically simulated with the entropy-porous model to predict the melting process of PCM. Transient dimensionless temperature curves are presented in terms of dimensionless numbers including Rayleigh (Ra), Fourier (Fo), and Stefan (Ste) numbers. Transient heat fluxes of natural convection and thermal radiation during the whole heat transfer process are characterized by regression analysis. Finally, a modified product of dimensionless numbers is derived based on the results of regression analysis. It is found that the temperature could be generalized well with the modified product of dimensionless numbers. The results could provide guidelines for generalizing the performance of PCM-based cooling plates utilized in remotely located electronics and could be served as a quick design tool.

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Document information

Title :

Investigation of Temperature Generalization for PCM-Based Cooling Plate Used for Remotely Located Electronics

Additional title:

Lect. Notes Electrical Eng.

Contributors:

Lee, Sangchul (editor) / Han, Cheolheui (editor) / Choi, Jeong-Yeol (editor) / Kim, Seungkeun (editor) / Kim, Jeong Ho (editor) / Wu, Bo (author) / Wang, Bin (author) / Zhao, Liang (author) / Han, Junjie (author)

Conference:

Asia-Pacific International Symposium on Aerospace Technology ; 2021 ; Korea (Republic of) November 15, 2021 - November 17, 2021

Published in:

The Proceedings of the 2021 Asia-Pacific International Symposium on Aerospace Technology (APISAT 2021), Volume 1 ; Chapter : 75 ; 977-986

Lecture Notes in Electrical Engineering ; 912

Publication date :

2022-08-31

Size :

10 pages

ISBN :

978-981-19-2689-1 , 978-981-19-2688-4

ISSN :