This specification covers an filled, room-temperature-polymerizing epoxy resin formulation, supplied as a two-component system.
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage
1981-10-01
Conference paper
English
Insulation , Test procedures , Thermoplastics , Molding , Drying , Resins , Suppliers , Documentation , Polymers
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