This specification covers a filled epoxy resin formulation, supplied as a two-component system, requiring an oven cure for attainment of maximum properties.
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Heat Cure, Low CTE Thermal Shock Resistant
1991-07-01
Conference paper
English
Insulation , Test procedures , Thermoplastics , Drying , Gravity , Resins , Suppliers , Documentation , Polymers
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