The Correlation of Microstructure, Microhardness, and Microchemistry in Resistance Welded Electronic Leads
The Correlation of Microstructure, Microhardness, and Microchemistry in Resistance Welded Electronic Leads
- New search for: Breen, J. E.
- New search for: Vahey, P. K.
- New search for: Breen, J. E.
- New search for: Vahey, P. K.
A study was made on the nature of the weld interface obtained in resistance welding of component leads used in electronic packages. To this end an investigation was made comparing the microstructure, microhardness, and microchemistry of a variety of cross wire resistance welds. Specifically, the investigation concerned itself with the variations in microhardness, and microchemistry at and near the weld interface as a function of metallographic structure, distance from the interface, and type of material being welded.This study will help answer such questions as the amount of diffusion of one weld component into another, the effects of welding on the mechanical properties near and adjacent to the weld, and provide for a more intelligent interpretation of the variety of microstructures that have been observed.The results of this work can be summarized as follows:
Document information
The Correlation of Microstructure, Microhardness, and Microchemistry in Resistance Welded Electronic Leads
Sae Technical Papers
Electronic Packaging Conference ; 1965
1965-02-01
Conference paper
English
Nickel alloys , Welding , Chemicals , Iron , Copper , Alloys , Composite materials , Beryllium , Nickel
Similar titles
Microchemistry and Microhardness as a Function of Microstructure in Parallel Gap Welds
| SAE Technical Papers | 1967
Microstructure and Mechanical Properties of Welded Thermoplastics
| SAE Technical Papers | 2004