Novel Micro ElectroMechanical Systems (MEMS) Packaging for the Skin of the Satellite

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Novel Micro ElectroMechanical Systems (MEMS) Packaging for the Skin of the Satellite

Darrin, M. Ann / Osiander, Robert / Lehtonen, John / Farrar, Dawnielle / Douglas, Donya / Swanson, Ted

This paper includes a discussion of the novel packaging techniques that are needed to place MEMS based thermal control devices on the skin of various satellites, eliminating the concern associated with potential particulates &om integration and test or the launch environment. Protection of this MEMS based thermal device is achieved using a novel polymer that is both IR transmissive and electrically conductive. This polymer was originally developed and qualified for space flight application by NASA at the Langley Research Center. The polymer material, commercially known as CPI, is coated with a thin layer of ITO and sandwiched between two window-like frames. The packaging of the MEMS based radiator assembly offers the benefits of micro-scale devices in a chip on board fashion, with the level of protection generally found in packaged parts.

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Document information

Title :

Novel Micro ElectroMechanical Systems (MEMS) Packaging for the Skin of the Satellite

Contributors:

Darrin, M. Ann (author) / Osiander, Robert (author) / Lehtonen, John (author) / Farrar, Dawnielle (author) / Douglas, Donya (author) / Swanson, Ted (author)

Conference:

2004 IEEE Aerospace Conference ; 2004 ; Big Sky, MT, United States

Publication date :

2004-12-15

ISBN :

0-7803-8155-6

Type of media :

Preprint

Type of material :

No indication

Language :

English