X-ray topography as a process control tool in semiconductor and microcircuit manufacture

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X-ray topography as a process control tool in semiconductor and microcircuit manufacture

X-ray topography as a process control tool in semiconductor and microcircuit manufacture

Parker, D. L. / Porter, W. A.

A bent wafer camera, designed to identify crystal lattice defects in semiconductor materials, was investigated. The camera makes use of conventional X-ray topographs and an innovative slightly bent wafer which allows rays from the point source to strike all portions of the wafer simultaneously. In addition to being utilized in solving production process control problems, this camera design substantially reduces the cost per topograph.

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Title :

X-ray topography as a process control tool in semiconductor and microcircuit manufacture

Contributors:

Parker, D. L. (author) / Porter, W. A. (author)

Published in:

NASA. Marshall Space Flight Center Proc. of the ASPE(MSFC Symp. on Eng. and Productivity Gains from Space Technol.

Publication date :

1977-05-01

Type of media :

Conference paper

Type of material :

No indication

Language :

English

Keywords :

Engineering (General)

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