This viewgraph information provides information on how the NASA Electronic Parts and Packaging (NEPP) Program evaluates the reliability of technologies for Electrical, Electronic, and Electromechanical (EEE) parts, and their suitability for spacecraft applications.


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    Title :

    Risk Management of Microelectronics: The NASA Electronic Parts and Packaging (NEPP) Program


    Contributors:
    K. A. LaBel (author) / M. J. Sampson (author)

    Publication date :

    2005


    Size :

    12 pages


    Type of media :

    Report


    Type of material :

    No indication


    Language :

    English




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