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    Title :

    Reliability of Lead-free solder for Automotive Electronic Devices and Its Applications


    Contributors:
    Hata, T. (author) / Ohmura, J. (author) / Moriyama, M. (author) / Watanabe, T. (author)

    Published in:

    Publication date :

    2002-01-01


    Size :

    10 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    Unknown


    Classification :

    DDC:    629.22



    Lead free solder for automotive electronics

    Whitten,G. / Delphi Delco Electronics Systems,US | Automotive engineering | 1998


    Lead Free Solder for Automotive Electronics

    Whitten, G. / Society of Automotive Engineers | British Library Conference Proceedings | 1998


    Lead-free solder development for automotive electronics packaging applications

    Shangguan, Dongkai / Achari, A. | Tema Archive | 1995


    Lead Free Solder for Automotive Electronics

    Whitten, Gordon | SAE Technical Papers | 1998