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    Title :

    2005-01-0557 Innovative Power Packaging for Demanding Automotive Power Electronics



    Conference:

    Systems engineering, electronics simulation, advanced electronics packaging, and electromagnetic compatibility ; 2005 ; Detroit, MI



    Publication date :

    2005-01-01


    Size :

    8 pages


    Remarks:

    Held as a session of the SAE 2005 World Congress. Papers from a session of the SAE 2005 World Congress, Detroit, Mich. Includes bibliographic references.



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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