2005-01-0557 Innovative Power Packaging for Demanding Automotive Power Electronics
Systems engineering, electronics simulation, advanced electronics packaging, and electromagnetic compatibility ; 2005 ; Detroit, MI
Systems engineering, electronics simulation, advanced electronics packaging, and electromagnetic compatibility ; 1926 (2005) ; 17-24
SAE SP ; 1926 (2005)
2005-01-01
8 pages
Held as a session of the SAE 2005 World Congress. Papers from a session of the SAE 2005 World Congress, Detroit, Mich. Includes bibliographic references.
Conference paper
English
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
2005-01-0557 Innovative Power Packaging for Demanding Automotive Power Electronics
British Library Conference Proceedings | 2005
|Innovative Power Packaging for Demanding Automotive Power Electronics
SAE Technical Papers | 2005
|Innovative power packaging for demanding automotive power electronics
Automotive engineering | 2005
|Innovative connectivity for power dice in mechatronic packaging of automotive power electronics
Automotive engineering | 2007
|Innovative die bonding technology for mechatronic packaging of automotive power electronics
Automotive engineering | 2006
|