WB1.4 Performance of an Ultra-Low Loss, Ultra Compact, Free-Space Packaging Platform for CWDM Applications

Optical interconnects & VLSI photonics ; 2004 ; San Diego, Calif

Optical interconnects & VLSI photonics ; 73-74

DIGEST OF THE IEEE LEOS SUMMER TOPICAL MEETINGS ; 2004

2004-01-01

2 pages

IEEE cat. no. 04TH8728. Held as part of the 2004 IEEE/LEOS Summer topical meeting

0780383060

1099-4742

Conference paper

Print

English

Optical interconnects , VLSI photonics , IEEE , LEOS

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