Overlay Multichip Modale Packaging for High Performance MEMS Instruments

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Overlay Multichip Modale Packaging for High Performance MEMS Instruments

Overlay Multichip Modale Packaging for High Performance MEMS Instruments

Butler, J. F. / Comtois, J. A. / Bright, V. M. / Instrument Society of America; Aerospace Industries Division / Instrument Society of America; Test Measurement Division

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Title :

Overlay Multichip Modale Packaging for High Performance MEMS Instruments

Contributors:

Butler, J. F. (author) / Comtois, J. A. (author) / Bright, V. M. (author) / Instrument Society of America; Aerospace Industries Division / Instrument Society of America; Test Measurement Division

Conference:

44th, International instrumentation symposium ; 1998 ; Reno; NV

Published in:

International instrumentation symposium ; 219-228

PROCEEDINGS OF THE INTERNATIONAL INSTRUMENTATION SYMPOSIUM ; 44

Publication date :

1998-01-01

Size :

10 pages

Remarks:

Also known as the 44th IIS

ISBN :

ISSN :

Type of media :

Conference paper

Type of material :

Print

Language :

English

Keywords :

instrumentation , ISA , aerospace industries , test measurement , IIS

© Metadata Copyright the British Library Board and other contributors. All rights reserved.

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