Title :

High-speed 3D inspection system for solder bumps [2597-22]

Contributors:

Tsukahara, H. (author) / Nishiyama, Y. (author) / Takahashi, F. (author) / Fuse, T. (author) / Batchelor, B. G. / Solomon, S. S. / Waltz, F. M. / SPIE

Conference:

Conference, Machine vision applications, architectures, and systems integration IV ; 1995 ; Philadelphia; PA

Machine vision applications, architectures, and systems integration IV ; 2597 ; 168-177

PROCEEDINGS- SPIE THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING ; 2597

Publication date :

1995-01-01

Size :

10 pages

ISBN :

0819419613

ISSN :

0361-0748

Type of media :

Conference paper

Type of material :

Print

Language :

English

Keywords :

machine vision applications , architectures , systems integration , SPIE

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