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    Continuous Improvement Efforts in Wire Bonding

    Continuous Improvement Efforts in Wire Bonding


    Concerns with stripping and soldering copper magnet wire in ignition coils and other related products have led to the investigation of an alternative product and process design, microjoining. This paper describes the initial development occurring during the improvement phase of a Six Sigma project. The use of microjoining with a folded over welding tab terminal design coupled with a parallel gap welding process is developed as a suitable method for joining a tin plated brass terminals to the 0.65mm magnet wire without prior removal of the polyesterimide over-coated polyamideimide insulation.

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    Titel :

    Continuous Improvement Efforts in Wire Bonding

    Weitere Titelangaben:

    Sae Technical Papers

    Beteiligte:
    Lynch, Donald P. (Autor:in) / Fleischmann, Jay E. (Autor:in) / Duff, William S. (Autor:in)
    Kongress:

    SAE 2002 World Congress & Exhibition ; 2002

    Erschienen in:

    Sae Technical Paper Series

    Erscheinungsdatum :

    2002-03-04

    ISSN :

    2688-3627 , 0148-7191

    DOI :

    https://doi.org/10.4271/2002-01-0894

    Medientyp :

    Aufsatz (Konferenz)

    Format :

    Print

    Sprache :

    Englisch

    Schlagwörter :

    Connectors and terminals , Six Sigma , Welding , Insulation , Copper , Magnetic materials , Joining

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