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encapsulation
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keywords:(encapsulation)
Innovative vibro-acoustic metamaterials to provide lightweight NVH solutions
Thermal management for high performance computing in spaceborne applications
Design limitations of powertrain electronics - automotive EMC challenges
A study of chip top delamination in plastic encapsulated packages under temperature loading
Source characterization of the lower front-end of a diesel engine
Thermal characterization of a mercury arc lamp for a projection display system
Motorola and MEMMS: the way up to a surface micromachined accelerometer
A Novel Technology for Thermal Control for ISP module for Space Applications
High efficiency, high reliability 2 kW inverter for aeronautical application
Skylab, part 3 - life-support systems
Optimized cooling systems for high-power semiconductor devices
Variable emissivity through MEMS technology
The application of microtechnology to sensors for the automotive industry
Memory chip packaging-an enabling technology for high-performance recce systems
Initial performance of advanced designs for IPV nickel-hydrogen cells
New method for electrothermal simulations: HDTMOS in automotive applications
Thesound reduction index applied to automotive problems
Long life radioisotopic power sources encapsulated in platinum metal alloys
Plastic encapsulated components for cars
Noise reduction on trucks of 6 to 10 t gvw through engine encapsulation
Totally enclosed heat pipe cooled induction motor (theoretical and experimental results)
Heavy-ion single-event effects testing of lead-on-chip assembled high-density memories
Specification of EX'e' enclosures for electrical equipment for use in hazardous atmosphaeres
Performance of new silicone adhesives and encapsulants at high and low temperatures