Zerspanen metallischer Werkstoffe
Vibration-induced fatigue failures in bonding wires used in stacked chip modules
Use of Nonvolatile Semiconductor Circuits in Autonomous Spacecraft Control
Triple RISC image operator for real-time image processing applications
Study of Conformal Coating on Chip-on-Board Technology for Space Applications
Solid-state circuits; ISSCC 2012; blick auf die Chips von morgen
Segmentation of moving objects at frame rate: a dedicated hardware solution
Satellite-On-A-Chip Feasibility for Distributed Space Missions
Reliability improvements in solder bump processing for flip chips
Recent advances in vision based detection technology for traffic applications
Product Assurance Technology for Custom LSI/VLSI Electronics