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Synonyme wurden verwendet für: Halbleiterbauelement
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    GaAs Optical Field Effect Transistor (OPFET): A High Performance Photodetector for Automotive Applications

    Gaitonde, Jaya / Lohani, R B | SAE Technical Papers | 2016
    Schlagwörter: Semiconductors

    Obtaining Diagnostic Coverage Metrics Using Rapid Prototyping of Multicore Systems

    Bruno, Fabio / Schneider, Rolf / Brewerton, Simon | SAE Technical Papers | 2011
    Schlagwörter: Semiconductors

    Systems to Silicon: A Complete System Approach to Power Semiconductor Selection for Environmentally Friendly Vehicles

    Sullivan, Charles / Campbell, Robert J. / Sugiarto, Tanto | SAE Technical Papers | 2010
    Schlagwörter: Semiconductors

    Technologies and reliability of modern embedded flash cells

    Sikora, A. / Pesl, F.P. / Unger, W. et al. | Tema Archiv | 2006
    Schlagwörter: Halbleiterbauelement

    The easy way to get aerospace quality semiconductors

    Saddler, J. | Tema Archiv | 1978
    Schlagwörter: HALBLEITERBAUELEMENT

    Avoiding Electrical Overstress for Automotive Semiconductors by New Connecting Concepts

    Thienel, Christoph | SAE Technical Papers | 2009
    Schlagwörter: Semiconductors

    A lightweight 8-14 micrometer thermal imager

    Griffiths, P.J. | Tema Archiv | 1978
    Schlagwörter: HALBLEITERBAUELEMENT

    Reliability engineering-an integrated approach at Daimler Chrysler

    Renner, J.H. | Tema Archiv | 1999
    Schlagwörter: Halbleiterbauelement

    Definition of driver information instrumentation feature

    Grune, E.S. / Sendelbach, D.R. | Tema Archiv | 1980
    Schlagwörter: HALBLEITERBAUELEMENT

    Extraction of accurate thermal compact models for fast electro-thermal simulation of IGBT modules in hybrid electric vehicles

    Ciappa, M. / Fichtner, W. / Kojima, T. et al. | Tema Archiv | 2005
    Schlagwörter: Halbleiterbauelement

    Reliability screening through electrical testing for press-fit alternator power diode in automotive application

    Tan, Cher-Ming / Chiu, J. / Liu, R. et al. | Tema Archiv | 2005
    Schlagwörter: Halbleiterbauelement

    In situ Defect-screening of Integrated LDMOS for Critical Automotive Applications

    Malandruccolo, V. / Ciappa, M. / Fichtner, W. et al. | Tema Archiv | 2010
    Schlagwörter: Halbleiterbauelement

    Semiconductors in high temperature applications - a future trend in automotive industry

    Goroll, M. / Pufall, R. / Kanert, W. et al. | Tema Archiv | 2004
    Schlagwörter: Halbleiterbauelement

    Silicon Carbide Inverter for EV/HEV Application featuring a Low Thermal Resistance Module and a Noise Reduction Structure

    Okubo, Akinori / Numakura, Keiichiro / Emori, Kenta et al. | SAE Technical Papers | 2017
    Schlagwörter: Semiconductors

    Preparing for Increased Electrostatic Discharge Device Sensitivity

    Montoya, Julian A. | Tema Archiv | 2014
    Schlagwörter: Halbleiterbauelement

    Microelectronics for space applications - challenges and opportunities

    Kayali, S. | Tema Archiv | 2007
    Schlagwörter: Halbleiterbauelement

    A R-evolution in power electronics: from "intelligent" to "super smart power" in automotive

    Marchio, F. / Poletto, V. / Russo, A. et al. | Tema Archiv | 2004
    Schlagwörter: Halbleiterbauelement

    Mission Profiles as an Approach to Manage Specific Automotive Requirements for Robust Design of Automotive Semiconductors

    Hahn, Daniel / Middendorf, Andreas / Straube, Stefan et al. | Tema Archiv | 2014
    Schlagwörter: Halbleiterbauelement

    IIoT-Enabled Production System for Composite Intensive Vehicle Manufacturing

    Pilla, Srikanth / Yerra, Veera Aditya | SAE Technical Papers | 2017
    Schlagwörter: Semiconductors

    Reliability of thick Al wire bonds in IGBT modules for traction motor drives

    Onuki, J. / Koizumi, M. / Suwa, M. | Tema Archiv | 2000
    Schlagwörter: Halbleiterbauelement

    Proc. Automated testing for electron. manufacturing seminar exhibit, June 16-19, 1980, Boston, USA (Ate system technology)

    Tema Archiv | 1980
    Schlagwörter: HALBLEITERBAUELEMENT

    The VMOS power device - A direct interface between microprocessors

    Blanchard, R. | Tema Archiv | 1977
    Schlagwörter: HALBLEITERBAUELEMENT

    Automotive electronic instrumentation - displays and sensors, congress and exposition, Detroit, USA, February 25-29, 1980 (SAE Publ. SP-457)

    Tema Archiv | 1980
    Schlagwörter: HALBLEITERBAUELEMENT

    Reliability aspects of semiconductor devices in high temperature applications

    Kanert, W. / Dettmer, H. / Plikat, B. et al. | Tema Archiv | 2003
    Schlagwörter: Halbleiterbauelement

    The redesign of a warranty distribution network with recovery processes

    Jalal Ashayeri | Online Contents | 2015
    Schlagwörter: Semiconductors

    Strain depending reliability of automotive diodes

    Galateanu, L. / Stoica, M.G. / Popa, E. | Tema Archiv | 1998
    Schlagwörter: Halbleiterbauelement

    Microtechnology for space systems

    Janson, S. / Helvajian, H. / Amimoto, S. et al. | Tema Archiv | 1998
    Schlagwörter: Halbleiterbauelement

    Power semiconductor devices - development trends and system interactions

    Lorenz, L. | Tema Archiv | 2007
    Schlagwörter: Halbleiterbauelement

    A Novel Cloud-Based Additive Manufacturing Technique for Semiconductor Chip Casings

    Subramanian, Jeyanthi / Siddharth, S. / Viswanath, Shreya | SAE Technical Papers | 2022
    Schlagwörter: Semiconductors

    New on-chip screening of gate oxides smart power devices for automotive applications

    Malandruccolo, V. / Ciappa, M. / Rothleitner, H. et al. | Tema Archiv | 2009
    Schlagwörter: Halbleiterbauelement

    Advanced IGBT modules for railway traction applications: Reliability testing

    Berg, H. / Wolfgang, E. | Tema Archiv | 1998
    Schlagwörter: Halbleiterbauelement

    Defense Standardization Program Journal. November 2002/February 2003

    NTIS | 2003
    Schlagwörter: Semiconductors

    Reliability of MEMS - a methodical approach

    Muller-Fiedler, R. / Wagner, U. / Bernhard, W. | Tema Archiv | 2002
    Schlagwörter: Halbleiterbauelement

    Acceptance checking methods for UHF electronic components

    Blinov, A.V. / Kanakov, A.G. / Trusov, V.A. et al. | Tema Archiv | 2000
    Schlagwörter: Halbleiterbauelement

    Bipolar phototransistors reliability assessment for space applications

    Gilard, O. / Quadri, G. / Spezzigu, P. et al. | Tema Archiv | 2007
    Schlagwörter: Halbleiterbauelement

    Detection of tin plating and tin whisker mitigation

    Bjorndahl, W.D. / Singleton, L. / Griese, R. et al. | Tema Archiv | 2004
    Schlagwörter: Halbleiterbauelement

    Reliability of Au/Al bonding in plastic packages for high temperature (200 degrees C) and high current applications

    Passagrilli, C. / Gobbato, L. / Tiziani, R. | Tema Archiv | 2002
    Schlagwörter: Halbleiterbauelement

    IEEE Applications Society, 10th IAS Annual Meeting, Hyatt Regency Atlanta, 28. Sept. - 2. Oct., 1975

    Tema Archiv | 1975
    Schlagwörter: HALBLEITERBAUELEMENT

    On-chip reliability investigations on power modules actually working in inverter systems

    Franke, T. / Honsberg-Riedl, M. / Simon, P. et al. | Tema Archiv | 1998
    Schlagwörter: Halbleiterbauelement

    Capillary Force-Driven Fluid Flow in Open Grooves with Different Sizes

    Chen, Tailian | AIAA | 2015
    Schlagwörter: Metal Oxide Semiconductors

    Electronic Warfare: Military needs propel mini-RPVs into tactical flight tests

    Davis, R.T. | Tema Archiv | 1975
    Schlagwörter: HALBLEITERBAUELEMENT

    Reliable power electronics for automotive applications

    Seliger, N. / Wolfgang, E. / Lefranc, G. et al. | Tema Archiv | 2002
    Schlagwörter: Halbleiterbauelement

    Simultaneous Analytical Solution of the Complete System of Double-Inlet Pulse Tube Refrigerator

    Ghahremani, A. R. / Saidi, M. H. / Ebrahimian, M. | AIAA | 2012
    Schlagwörter: Metal Oxide Semiconductors

    Innovative Optimal Control Methodology of Heat Dissipation in Electronic Devices

    Jang, Horng-Yuan | AIAA | 2008
    Schlagwörter: Metal Oxide Semiconductors

    Long term reliability testing of HV-IGBT modules in worst case traction operation

    Fratelli, L. / Cascone, B. / Giannini, G. et al. | Tema Archiv | 1999
    Schlagwörter: Halbleiterbauelement

    New developments in power electronics

    Cameron, Gary / Hayes, Monty / Lee, Han et al. | Tema Archiv | 2012
    Schlagwörter: Halbleiterbauelement

    Autonomous Transport Innovation: A Review of Enabling Technologies

    M. T. Gross / J. L. Webster | NTIS | 2021
    Schlagwörter: Semiconductors

    Fabrication, packaging, and performance of VCSELs and photodetectors for space applications

    Briggs, R.D. / Armendariz, M.G. / Geib, K.M. et al. | Tema Archiv | 1999
    Schlagwörter: Halbleiterbauelement

    The past, present and future of EEE components for space application; COTS-the next generation

    Wall, J. / Sinnadurai, N. | Tema Archiv | 1998
    Schlagwörter: Halbleiterbauelement

    Reliability assurance for optical semiconductor devices

    Iwane, G. / Nakano, Y. / Sudo, H. | Tema Archiv | 1985
    Schlagwörter: HALBLEITERBAUELEMENT

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