On-chip reliability investigations on power modules actually working in inverter systems

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On-chip reliability investigations on power modules actually working in inverter systems

Franke, T. / Honsberg-Riedl, M. / Simon, P. / Otto, J. / Ramminger, S. / Soelkner, G. / Wolfgang, E.

This paper contains the results of temperature measurements for reliability investigations of IGBT modules working in inverters for industrial and traction applications. For this purpose, the chip temperature and its transient behaviour have been monitored under different inverter driving conditions. Specially prepared IGBT modules have been used to investigate the industrial and traction inverters in terms of their electrical and thermal behaviour. The measurement techniques were appropriately adapted to the different configurations of the two inverters.

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Dokumentinformationen

Titel :

On-chip reliability investigations on power modules actually working in inverter systems

Beteiligte:

Franke, T. (Autor:in) / Honsberg-Riedl, M. (Autor:in) / Simon, P. (Autor:in) / Otto, J. (Autor:in) / Ramminger, S. (Autor:in) / Soelkner, G. (Autor:in) / Wolfgang, E. (Autor:in)

Erschienen in:

Reliability of Electron Devices, Failure Physics and Analysis, 1998 ; 1361-1366

Microelectronics Reliability ; 38 , 6-8

Erscheinungsdatum :

1998

Format / Umfang :

6 Seiten, 5 Quellen

ISSN :

0026-2714

DOI :

https://doi.org/10.1016/S0026-2714(98)00132-2

Medientyp :