2003-01-0826 Relation Between Aluminum Die-Casting Conditions and Dimensional Stability
Compact Flip-Chip Interconnection 112-Gbit/s EADFB Laser Array Module With High Eye-Mask Margin
Development and Application of Microgravity Measurement Equipment
JEM Thermal Control System and Heat Exchanger Development
JEM Thermal Control System and Heat Exchanger Development
Mixture Formation and Auto-Ignition Behavior of Pure and Mixed Normal Paraffin Fuels
Power Beaming Technology Demonstration Satellite for SOLARBIRD Space Solar Power System
Three-Dimensional Shape Measurement With High-Energy X-ray CT-Scan
Ultra-Compact 100 GbE Transmitter Optical Sub-Assembly for 40-km SMF Transmission
Virtual Wavelength Path Cross-Connect Based on Optoelectronic Wavelength Conversion