MCM application: automotive case studies
MCM application: automotive case studies
- Neue Suche nach: Dall'Agnese, P.
- Neue Suche nach: Dall'Agnese, P.
Automotive electronics demands more and more increased functionalities with less packaging size and of course lower costs and improved quality. A way out of the dilemma between performance, function improvements and cost reduction can be the application of new technologies and processes. Some of the product applications were identified to support and validate MCM technologies. Ball Grid Array (BGA) packaging was selected since this innovative package offers advantages in space saving, board routing and manufacturing process yield. Evaluation started on MCM dedicated to engine management system, it is quite understood that MCM applications are not limited to engine management; this paper presents a generic Anti-Lock Brake Control Unit on which flip-chip technology succeeds to usual wire bonding. Technical and economical aspects are approached in the MCM development, the BGA packages and MCM technology will be qualified in 1996, in order to positively answer to application which should achieve high production volume for the end of this century.
Dokumentinformationen
MCM application: automotive case studies
Anwendungen für Multichipmodule: Fallstudie am Beispiel von Kraftfahrzeugelektronik
1996
5 Seiten, 10 Bilder, 11 Quellen
Aufsatz (Konferenz)
Englisch
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