This paper presents progress in developing and demonstrating an analytical method for evaluating avionics Printed Circuit Board (PCB) and Line Replaceable Unit (LRU) life prediction. The analytical method being developed includes life prediction for vibration and thermal cycling environments which will be integrated with existing steady-state temperature life prediction algorithms. The prediction method that is presented herein provides a capability based on finite element modeling as applied to vibration and thermal environments that are encountered in the service of avionic equipment on board military aircraft. The purpose of the effort is to develop an analytical capability to be used by government procurement agencies to evaluate the avionic designs developed by contractors. That is, governmental agencies would use this capability to assure that the equipment is satisfactory both vibratory and thermal environmental requirements. The experimental validation efforts and progress to validate thermal/structural prediction models are discussed herein.
Prediction of avionic structural reliability
Prognose der Zuverlaessigkeit in der Avionik
1987
12 Seiten, 14 Bilder, 2 Tabellen, 12 Quellen
Aufsatz (Konferenz)
Englisch
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