An Electromechanical Impedance-Based Mobile System for Structural Health Monitoring and Reliability Check of Bonded Piezoelectric Sensors

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An Electromechanical Impedance-Based Mobile System for Structural Health Monitoring and Reliability Check of Bonded Piezoelectric Sensors

Lilov, Mihail / Siebel, Thomas

In many novel industrial applications, piezoelectric transducers (PZT) are used in sensing or actuating systems. These applications could be, for example, piezo-based structural health monitoring systems for aircrafts or active vibration reducing systems for automotive. Due to the fact that PZT materials are brittle, depolarize at high-temperature exposure or that the bonding layer to host structures for bonded transducers can degrade, monitoring of the reliability of these transducers is crucial to guarantee proper system operation. The electromechanical impedance (EMI) method allows monitoring of structural changes with only a single PZT applied to the surface of a structure. In the data analysis, it is furthermore possible to distinguish whether the host structure, the PZT material itself, or the bonding between PZT material and host structure is affected by damage. Object of this work is the implementation of the electromechanical impedance method on a compact, electronic node. Investigations of the EMI method and verification of the electronic node are conducted on an aerospace conform fiber reinforced plastic structure. Furthermore, the temperature effect on the measurement results is investigated, and methods for temperature effect compensation are applied.