Modeling Thermal Residual Stresses in Composite Patch Repairs During Multitemperature Bonding Cycles
J. Cho, C. T. Sun
Journal of Aircraft ; 40 , 6 ; 1200-1205
2003-01-01
6 pages
Aufsatz (Zeitschrift)
Elektronische Ressource
Englisch
Modeling Thermal Residual Stresses in Composite Patch Repairs During Multitemperature Bonding Cycles
Online Contents | 2003
|Multi-Step Bonding Cycles for Lowering Thermal Residual Stresses in Composite Patch Repairs
British Library Conference Proceedings | 2002
|Thermal residual stresses in bonded repairs
Tema Archiv | 2002
|